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Connectors (Sockets)
Manufacturer / Brand: TE
Desc.: DDR3 DIMM, DIMM Sockets, Double Data Rate (DDR) 3, Board-to-Board, 240 Position, Through Hole - Solder, Vertical Module Orientation
Alias (Internal Part Number): -
Quantity Available: Over 729400 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Datasheet for 1-1932680-1:
Detailed Description for 1-1932680-1:
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DRAM Type : Double Data Rate (DDR) 3
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Connector System : Board-to-Board
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Number of Positions : 240
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PCB Mounting Style : Through Hole - Solder
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Module Orientation : Vertical
1-1932680-1 Parameters
- Manufacturer Part Number : 1-1932680-1
- Manufacturer : TE
- Description : DDR3 DIMM, DIMM Sockets, Double Data Rate (DDR) 3, Board-to-Board, 240 Position, Through Hole - Solder, Vertical Module Orientation
- Series: DDR3 DIMM
- TE Internal Part Code: 1-1932680-1
- Internal Description: VLP DDR3 DIMM 240POS. 1.0PITCH
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-1-1932680-1
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 1-1932680-1
Best Price for 1-1932680-1
Contact us to check the best price and real time inventory quantity for 1-1932680-1. If you need any more information about 1-1932680-1, you can also send us by email. Our email is sales@buy-te.com
1-1932680-1 Technical Documents (Datasheet and Drawing Files)
Product Description
DDR3 DIMM Sockets are designed to JEDEC industry standards. They are available with vertical and right angle orientations and through hole and surface mount configurations. DDR3 DIMM Socket applications include servers, notebook PCs, and communications equipment.
View All DDR3 DIMM SOCKETS (15)
Product Drawings
- VLP DDR3 DIMM 240POS. 1.0PITCH VLP DDR3 DIMM 240POS. 1.0PITCH English
CAD Files
- 3D PDF 3D_CVM_CVM_1-1932680-1_A1.pdf 3D
- Customer View Model ENG_CVM_CVM_1-1932680-1_A1.2d_dxf.zip English
- ENG_CVM_CVM_1-1932680-1_A1.3d_igs.zip English
- ENG_CVM_CVM_1-1932680-1_A1.3d_stp.zip English
Product Specifications
- Product Specification ENG_SS_108-115019_A.pdf English
Product Environmental Compliance
- TE Material Declaration ENG_PC_MD_1-1932680-1_A.pdf English
Additional Description for 1-1932680-1
Product Description
DDR3 DIMM Sockets are designed to JEDEC industry standards. They are available with vertical and right angle orientations and through hole and surface mount configurations. DDR3 DIMM Socket applications include servers, notebook PCs, and communications equipment.
View All DDR3 DIMM SOCKETS (15)
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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DRAM Type : Double Data Rate (DDR) 3
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Connector System : Board-to-Board
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Sealable : No
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Connector & Contact Terminates To : Printed Circuit Board
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Center Post : Without
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Product Type : Socket
Configuration Features
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Number of Positions : 240
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Module Orientation : Vertical
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Number of Bays : 2
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Number of Rows : 2
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Keying : Standard
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Number of Keys : 1
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Center Key : Offset Left
Electrical Characteristics
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DRAM Voltage (V): 1.5
Body Features
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Ejector Type : Rotary
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Retention Post Location : Both Ends
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Latch Color : Natural
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Module Key Type : Offset Left
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Latch Material : Thermoplastic
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Ejector Location : Both Ends
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Ejector Material : Thermoplastic
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Retention Post Material : Copper Alloy
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Ejector Material Color : Natural
Contact Features
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Contact Base Material : Copper Alloy
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PCB Contact Termination Area Plating Material : Tin
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Contact Current Rating (Max) (A): .5
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Socket Type : Memory Card
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Socket Style : DIMM
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Solder Tail Contact Plating Thickness : 2.54 µm [ 100 µin ]
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Contact Mating Area Plating Thickness : .76 µm [ 30 µin ]
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Contact Mating Area Plating Material : Gold
Termination Features
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Insertion Style : Direct Insert
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Termination Post Length : 3.18 mm [ .125 in ]
Mechanical Attachment
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PCB Mount Retention Type : Boardlock
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PCB Mount Retention : With
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PCB Mounting Style : Through Hole - Solder
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Connector Mounting Type : Board Mount
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Locating Posts : Without
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Mounting Angle : Vertical
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Boardlock Material : Copper Alloy
Housing Features
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Centerline (Pitch) : 2 mm [ .07 in ]
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Housing Color : Black
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Housing Material : High Temperature Nylon
Dimensions
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Height Above PC Board : 21 mm [ .82 in ]
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Row-to-Row Spacing : 1.9 mm [ .075 in ]
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Center Retention Hole Diameter : 2.45 mm [ .096 in ]
Usage Conditions
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Operating Temperature Range (°C): -40 – 85, -40 – 85
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Operating Temperature Range (°F): -40 – 185, -40 – 185
Operation/Application
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Circuit Application : Signal
Industry Standards
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UL Flammability Rating : UL 94V-0
Packaging Features
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Packaging Method : Soft Tray
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Packaging Quantity : 54
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