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Connectors (Sockets)
Manufacturer / Brand: TE
Desc.: Pin Sockets, Socket Length .184 in [4.67 mm], Hole Size (Recommended) 1.32 mm [.052 in], Anti-Flux, Bullet Nose, 28 – 22AWG Wire Size
Alias (Internal Part Number): -
Quantity Available: Over 682600 Pieces
Our Email: sales@buy-te.com (Price quote by email)

Datasheet for 1-645955-2:

1-645955-2 datasheet
Price for 1-645955-2
Detailed Description for 1-645955-2:
1-645955-2 Parameters
  • Manufacturer Part Number : 1-645955-2
  • Manufacturer : TE
  • Description : Pin Sockets, Socket Length .184 in [4.67 mm], Hole Size (Recommended) 1.32 mm [.052 in], Anti-Flux, Bullet Nose, 28 – 22AWG Wire Size
  • Series: -
  • TE Internal Part Code: 1-645955-2
  • Internal Description: SOCKET,MIN-SPR B-N SN-AU SER-2
  • Our Price : Contact by email
  • Function : -
  • Status : Active
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : TE-1-645955-2
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : -
  • Other category: Pin Sockets
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1-645955-2 Technical Documents (Datasheet and Drawing Files)

Product Drawings

Product Specifications

Additional Description for 1-645955-2

Please review product documents or contact us for the latest agency approval information. 

 

Please Note: Use the Product Drawing for all design activity. 

Product Type Features

  • Socket Sleeve Style : Bullet Nose

  • Connector System : Cable-to-Board

  • Sealable : No

  • Connector & Contact Terminates To : Printed Circuit Board

  • Product Type : Contact

  • Profile : Zero

  • Wire/Cable Type : Discrete Wire

Body Features

  • Sleeve Plating Material : Tin

  • Sleeve Material : Copper

Contact Features

  • Contact Base Material : Beryllium Copper

  • Contact Current Rating (Max) (A): 5

  • Contact Type : Socket

  • Contact Spring Plating Thickness : .762 µm [ 30 µin ]

  • Contact Spring Plating Material : Gold

  • Contact Mating Area Plating Thickness : 30 µm [ 30 µin ]

  • Contact Transmits (Typical) : Signal (Data)/Power

  • Socket Type : Discrete

Termination Features

  • Termination Method to Printed Circuit Board : Through Hole - Press-Fit

  • Termination Method to Wire & Cable : Solder

  • Insertion Method : Hand/Semi-Automatic/Automatic

Dimensions

  • Socket Length : 4.67 mm [ .184 in ]

  • Hole Size (Recommended) : 1.32 mm [ .052 in ]

  • Wire Size (AWG): 28 – 22

  • Wire Size (mm²): .081 – .326

  • Mating Pin Diameter Range : .36 – .66 mm [ .014 – .026 in ]

  • PCB Thickness (Recommended) : .79 – 3.18 mm [ .031 – .125 in ]

Usage Conditions

  • Operating Temperature Range : -65 – 125 °C [ -85 – 257 °F ]

Operation/Application

  • Solder Process Feature : Anti-Flux

  • Circuit Application : Power & Signal

Packaging Features

  • Packaging Method : Reel

  • Packaging Quantity : 10000

Other

  • Spring Material : Beryllium Copper

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