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Connectors (Sockets)
Manufacturer / Brand: TE
Desc.: DIMM Sockets, Double Data Rate (DDR) 3, Board-to-Board, 240 Position, Through Hole - Press-Fit, Vertical Module Orientation, 1mm [.039in] Centerline
Alias (Internal Part Number): -
Quantity Available: Over 467800 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Detailed Description for 2013266-7:
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DRAM Type : Double Data Rate (DDR) 3
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Connector System : Board-to-Board
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Number of Positions : 240
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PCB Mounting Style : Through Hole - Press-Fit
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Module Orientation : Vertical
2013266-7 Parameters
- Manufacturer Part Number : 2013266-7
- Manufacturer : TE
- Description : DIMM Sockets, Double Data Rate (DDR) 3, Board-to-Board, 240 Position, Through Hole - Press-Fit, Vertical Module Orientation, 1mm [.039in] Centerline
- Series: -
- TE Internal Part Code: 2013266-7
- Internal Description: sockt assy vert DDR3 press fit 240pos
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-2013266-7
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 2013266-7
Best Price for 2013266-7
Contact us to check the best price and real time inventory quantity for 2013266-7. If you need any more information about 2013266-7, you can also send us by email. Our email is sales@buy-te.com
2013266-7 Technical Documents (Datasheet and Drawing Files)
Product Description
DDR3 DIMM Sockets are designed to JEDEC industry standards. They are available with vertical and right angle orientations and through hole and surface mount configurations. DDR3 DIMM Socket applications include servers, notebook PCs, and communications equipment.
View All DDR3 DIMM SOCKETS (15)
Product Drawings
- sockt assy vert DDR3 press fit 240pos sockt assy vert DDR3 press fit 240pos English
CAD Files
- 3D PDF 3D_CVM_CVM_2013266-7_F.pdf 3D
- Customer View Model ENG_CVM_CVM_2013266-7_F.2d_dxf.zip English
- ENG_CVM_CVM_2013266-7_F.3d_igs.zip English
- ENG_CVM_CVM_2013266-7_F.3d_stp.zip English
Product Environmental Compliance
- TE Material Declaration ENG_PC_MD_2013266-7_D.pdf English
Additional Description for 2013266-7
Product Description
DDR3 DIMM Sockets are designed to JEDEC industry standards. They are available with vertical and right angle orientations and through hole and surface mount configurations. DDR3 DIMM Socket applications include servers, notebook PCs, and communications equipment.
View All DDR3 DIMM SOCKETS (15)
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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DRAM Type : Double Data Rate (DDR) 3
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Connector System : Board-to-Board
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Sealable : No
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Connector & Contact Terminates To : Printed Circuit Board
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Center Post : Without
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Product Type : Socket
Configuration Features
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Number of Positions : 240
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Module Orientation : Vertical
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Number of Bays : 2
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Number of Rows : 2
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Keying : Standard
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Number of Keys : 1
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Center Key : Offset Left
Electrical Characteristics
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DRAM Voltage (V): 1.5
Body Features
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Ejector Type : Standard
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Retention Post Location : Both Ends
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Latch Color : Black
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Module Key Type : Offset Left
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Latch Material : High Temperature Thermoplastic
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Ejector Location : Both Ends
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Ejector Material : High Temperature Thermoplastic
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Ejector Material Color : Black
Contact Features
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Contact Base Material : Copper Alloy
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PCB Contact Termination Area Plating Material : Tin
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Contact Underplating Material : Nickel
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Contact Current Rating (Max) (A): .5
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Socket Type : Memory Card
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Socket Style : DIMM
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Solder Tail Contact Plating Thickness : 2.54 µm [ 100 µin ]
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Contact Mating Area Plating Thickness : .76 µm [ 30 µin ]
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Contact Mating Area Plating Material : Gold
Termination Features
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Insertion Style : Direct Insert
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Termination Post Length : 3.38 mm [ .133 in ]
Mechanical Attachment
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PCB Mount Retention Type : Solder Tail
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PCB Mount Retention : With
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PCB Mounting Style : Through Hole - Press-Fit
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Connector Mounting Type : Board Mount
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Polarization : Left
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Locating Posts : With
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Mounting Angle : Vertical
Housing Features
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Centerline (Pitch) : 1 mm [ .039 in ]
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Housing Color : Black
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Housing Material : High Temperature Nylon
Dimensions
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Height Above PC Board : 23.1 mm [ .9 in ]
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Row-to-Row Spacing : 1.9 mm [ .075 in ]
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Center Retention Hole Diameter : 1.8 mm [ .07 in ]
Usage Conditions
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Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]
Operation/Application
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Circuit Application : Signal
Industry Standards
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UL Flammability Rating : UL 94V-0
Packaging Features
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Packaging Method : Box & Tray, Tray
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Packaging Quantity : 64
Other
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Comment : With LED Position.
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