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    2201838-2
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    Connectors (Sockets)
    Manufacturer / Brand: TE
    Desc.: LGA Sockets, LGA 2011, Board-to-Board, 2011 Position, Gold, Contact Mating Area Plating Material Thickness 30 µin, 1.016mm [.04in] Centerline
    Alias (Internal Part Number): -
    Quantity Available: Over 59700 Pieces
    Our Email: sales@buy-te.com (Price quote by email)

    Datasheet for 2201838-2:

    2201838-2 datasheet
    Price for 2201838-2
    Detailed Description for 2201838-2:
    2201838-2 Parameters
    • Manufacturer Part Number : 2201838-2
    • Manufacturer : TE
    • Description : LGA Sockets, LGA 2011, Board-to-Board, 2011 Position, Gold, Contact Mating Area Plating Material Thickness 30 µin, 1.016mm [.04in] Centerline
    • Series: -
    • TE Internal Part Code: 2201838-2
    • Internal Description: SOCKET ASSY LGA2011-3 0.76um Au
    • Our Price : Contact by email
    • Function : -
    • Status : Active
    • ROHS Status : Rohs Compliant
    • Package Type : -
    • Standard Packing Type : Reel / Tray / Box
    • Standard Packing Quantity : -
    • Working Temperature : -
    • Other Part Number : TE-2201838-2
    • Shipping methods : DHL FEDEX UPS TNT
    • Delivery Time : Ship within 1 day.
    • Manufacturer Production time : 6-8 weeks (Normally have stocks)
    • Weight : -
    • Other category: -
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    Best Price for 2201838-2

    Contact us to check the best price and real time inventory quantity for 2201838-2. If you need any more information about 2201838-2, you can also send us by email. Our email is sales@buy-te.com

    2201838-2 Technical Documents (Datasheet and Drawing Files)

    Product  Description

    LGA 2011 Sockets were designed for use with Intel's Core i7 and Xeon 5 LGA 2011 (Sandy Bridge) CPU processors. They are available with Gold 15 or Gold 30 contact plating. LGA 2011 Socket applications include servers and high end desktops. View All LGA 2011 SOCKETS (6)

    Product Drawings

    CAD Files

    Product Specifications

    Product Environmental Compliance

    Additional Description for 2201838-2

    Product  Description

    LGA 2011 Sockets were designed for use with Intel's Core i7 and Xeon 5 LGA 2011 (Sandy Bridge) CPU processors. They are available with Gold 15 or Gold 30 contact plating. LGA 2011 Socket applications include servers and high end desktops. View All LGA 2011 SOCKETS (6)

    Please review product documents or contact us for the latest agency approval information. 

     

    Please Note: Use the Product Drawing for all design activity. 

    Product Type Features

    • Connector System : Board-to-Board

    • Connector & Contact Terminates To : Printed Circuit Board

    • Product Type : Socket

    Configuration Features

    • Number of Positions : 2011

    • Grid Spacing : 1.016 x .8814 mm [ .040 x .0347 in ]

    Body Features

    • Plating Thickness (µin): 30

    • Plating Material : Gold

    • Frame Style : Square

    Contact Features

    • Contact Base Material : Copper Alloy

    • IC Socket Type : LGA 2011

    • Contact Mating Area Plating Material : Gold

    • Contact Mating Area Plating Material Thickness (µin): 30

    • Contact Current Rating (Max) (A): .5

    Mechanical Attachment

    • PCB Mounting Style : Surface Mount Solder Ball

    • Connector Mounting Type : Board Mount

    • Heat Sink Attachment : Without

    Housing Features

    • Centerline (Pitch) : 1.016 mm [ .04 in ]

    • Housing Color : Black

    • Housing Material : High Temperature Thermoplastic

    Usage Conditions

    • Operating Temperature Range : -25 – 100 °C [ -13 – 212 °F ]

    Operation/Application

    • Circuit Application : Signal

    Industry Standards

    • UL Flammability Rating : UL 94V-0

    Packaging Features

    • Packaging Method : Tray

    • Tray Color : Black

    Other

    • Comment : Lead-Free Solderball

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