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Connectors (Sockets)
Manufacturer / Brand: TE
Desc.: LGA Sockets, LGA 1151, Board-to-Board, 1151 Position, Gold, Contact Mating Area Plating Material Thickness 15 µin, .9144mm [.036in] Centerline
Alias (Internal Part Number): -
Quantity Available: Over 113700 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Datasheet for 2287402-1:
Detailed Description for 2287402-1:
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IC Socket Type : LGA 1151
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Connector System : Board-to-Board
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Number of Positions : 1151
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Contact Mating Area Plating Material : Gold
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Contact Mating Area Plating Material Thickness (µin): 15
2287402-1 Parameters
- Manufacturer Part Number : 2287402-1
- Manufacturer : TE
- Description : LGA Sockets, LGA 1151, Board-to-Board, 1151 Position, Gold, Contact Mating Area Plating Material Thickness 15 µin, .9144mm [.036in] Centerline
- Series: -
- TE Internal Part Code: 2287402-1
- Internal Description: SOCKET ASSY LGA1151, 0.38AU
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-2287402-1
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 2287402-1
Best Price for 2287402-1
Contact us to check the best price and real time inventory quantity for 2287402-1. If you need any more information about 2287402-1, you can also send us by email. Our email is sales@buy-te.com
2287402-1 Technical Documents (Datasheet and Drawing Files)
Product Drawings
- SOCKET ASSY LGA1151, 0.38AU SOCKET ASSY LGA1151, 0.38AU English
CAD Files
- PCB Design Download symbol & footprint (SnapEDA)
- 3D PDF 3D_CVM_CVM_2287402-1_B.pdf 3D
- Customer View Model ENG_CVM_CVM_2287402-1_B.2d_dxf.zip English
- ENG_CVM_CVM_2287402-1_B.3d_igs.zip English
- ENG_CVM_CVM_2287402-1_B.3d_stp.zip English
Product Specifications
- Product Specification ENG_SS_108-78586_F.pdf English
Product Environmental Compliance
- TE Material Declaration ENG_PC_MD_2287402-1_C.pdf English
Additional Description for 2287402-1
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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Connector System : Board-to-Board
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Connector & Contact Terminates To : Printed Circuit Board
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Product Type : Socket
Configuration Features
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Number of Positions : 1151
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Grid Spacing : .914 x .914 mm [ .036 x .036 in ]
Body Features
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Plating Thickness (µin): 15
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Plating Material : Gold
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Frame Style : Square
Contact Features
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Contact Base Material : Copper Alloy
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IC Socket Type : LGA 1151
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Contact Mating Area Plating Material : Gold
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Contact Mating Area Plating Material Thickness (µin): 15
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Contact Current Rating (Max) (A): .5
Mechanical Attachment
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PCB Mounting Style : Surface Mount Solder Ball
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Connector Mounting Type : Board Mount
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Heat Sink Attachment : Without
Housing Features
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Centerline (Pitch) : .9144 mm [ .036 in ]
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Housing Color : Black
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Housing Material : High Temperature Thermoplastic
Usage Conditions
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Operating Temperature Range : -25 – 100 °C [ -13 – 212 °F ]
Operation/Application
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Circuit Application : Signal
Industry Standards
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UL Flammability Rating : UL 94V-0
Packaging Features
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Packaging Method : Tray
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Tray Color : Gray
Other
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Comment : Lead-Free Solderball
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