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Connectors (Sockets)
Manufacturer / Brand: TE
Desc.: DDR4 DIMM, DIMM Sockets, Double Data Rate (DDR) 4, Board-to-Bus Bar, 288 Position, Through Hole - Solder, Vertical Module Orientation
Alias (Internal Part Number): -
Quantity Available: Over 701900 Pieces
Our Email: sales@buy-te.com (Price quote by email)

Datasheet for 2308107-1:

2308107-1 datasheet
Price for 2308107-1
Detailed Description for 2308107-1:
2308107-1 Parameters
  • Manufacturer Part Number : 2308107-1
  • Manufacturer : TE
  • Description : DDR4 DIMM, DIMM Sockets, Double Data Rate (DDR) 4, Board-to-Bus Bar, 288 Position, Through Hole - Solder, Vertical Module Orientation
  • Series: DDR4 DIMM
  • TE Internal Part Code: 2308107-1
  • Internal Description: DDR4 DIMM 288 PIN TH TYPE
  • Our Price : Contact by email
  • Function : -
  • Status : Active
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : TE-2308107-1
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : -
  • Other category: -
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2308107-1 Technical Documents (Datasheet and Drawing Files)

Product  Description

DDR4 DIMM Sockets are designed to JEDEC industry standards. They are available with through hole and surface mount configurations. DDR4 DIMM Socket applications include servers, communications equipment, workstations, and high-performance computing. View All DDR4 DIMM SOCKETS (69)

Product Drawings

Product Specifications

Additional Description for 2308107-1

Product  Description

DDR4 DIMM Sockets are designed to JEDEC industry standards. They are available with through hole and surface mount configurations. DDR4 DIMM Socket applications include servers, communications equipment, workstations, and high-performance computing. View All DDR4 DIMM SOCKETS (69)

Please review product documents or contact us for the latest agency approval information. 

 

Please Note: Use the Product Drawing for all design activity. 

Product Type Features

  • DRAM Type : Double Data Rate (DDR) 4

  • Connector System : Board-to-Bus Bar

  • Sealable : No

  • Connector & Contact Terminates To : Printed Circuit Board

  • Profile : Standard

  • Center Post : Without

  • Product Type : Socket

Configuration Features

  • Number of Positions : 288

  • Module Orientation : Vertical

  • Number of Rows : 2

  • Keying : Standard

  • Number of Keys : 1

  • Center Key : Offset Right

Electrical Characteristics

  • DRAM Voltage (V): 1.2

Body Features

  • Ejector Type : Standard

  • Module Key Type : Offset Right

  • Latch Material : High Temperature Thermoplastic

  • Ejector Location : Both Ends

  • Latch Color : Black

  • Ejector Material : High Temperature Thermoplastic

  • Ejector Material Color : Black

Contact Features

  • Contact Base Material : Copper Alloy

  • PCB Contact Termination Area Plating Material : Tin

  • Contact Underplating Material : Nickel

  • Contact Current Rating (Max) (A): .75

  • Contact Mating Area Plating Thickness : .38 µm [ 15 µin ]

  • Socket Type : Memory Card

  • Socket Style : DIMM

  • Contact Mating Area Plating Material : Gold

Termination Features

  • Insertion Style : Direct Insert

Mechanical Attachment

  • PCB Mount Retention Type : Boardlock

  • PCB Mount Retention : With

  • PCB Mounting Style : Through Hole - Solder

  • Connector Mounting Type : Board Mount

  • Boardlock Material : Stainless Steel

Housing Features

  • Centerline (Pitch) : .85 mm [ .0334 in ]

  • Housing Color : Black

  • Housing Material : High Temperature Thermoplastic

Usage Conditions

  • Operating Temperature Range : -55 – 105 °C [ -67 – 221 °F ]

Operation/Application

  • Circuit Application : Signal

Industry Standards

  • UL Flammability Rating : UL 94V-0

Packaging Features

  • Packaging Method : Soft Tray

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