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Connectors (Sockets)
Manufacturer / Brand: TE
Desc.: DDR4 DIMM, SO DIMM Sockets, Small Outline (SO), Stack Height .315 in [8 mm], Right Angle Module Orientation, Surface Mount, Cable-to-Board
Alias (Internal Part Number): -
Quantity Available: Over 94200 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Datasheet for 2309412-5:
Detailed Description for 2309412-5:
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DRAM Type : Small Outline (SO)
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Stack Height : 8 mm [ .315 in ]
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Module Orientation : Right Angle
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PCB Mounting Style : Surface Mount
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Connector System : Cable-to-Board
2309412-5 Parameters
- Manufacturer Part Number : 2309412-5
- Manufacturer : TE
- Description : DDR4 DIMM, SO DIMM Sockets, Small Outline (SO), Stack Height .315 in [8 mm], Right Angle Module Orientation, Surface Mount, Cable-to-Board
- Series: DDR4 DIMM
- TE Internal Part Code: 2309412-5
- Internal Description: DDR4 SODIMM 260P 8.0H RVS
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-2309412-5
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 2309412-5
Best Price for 2309412-5
Contact us to check the best price and real time inventory quantity for 2309412-5. If you need any more information about 2309412-5, you can also send us by email. Our email is sales@buy-te.com
2309412-5 Technical Documents (Datasheet and Drawing Files)
Product Description
DDR4 SO DIMM Sockets are designed to JEDEC industry standards. They are available with standard and reverse key positions, GF, 5u", 10u", 15u", and 30u" gold thicknesses, 4.0mm, 5.2, 8.0, and 9.2 heights, and tray and reel packaging. DDR4 SO DIMM Socket applications include mass storage, communications, desktop PCs, and instrument equipment.
View All DDR4 SO DIMM SOCKETS (39)
Product Drawings
- DDR4 SODIMM 260P 8.0H RVS DDR4 SODIMM 260P 8.0H RVS English
CAD Files
- 3D PDF 3D_CVM_CVM_2309412-5_1.pdf 3D
- Customer View Model ENG_CVM_CVM_2309412-5_1.2d_dxf.zip English
- ENG_CVM_CVM_2309412-5_1.3d_igs.zip English
- ENG_CVM_CVM_2309412-5_1.3d_stp.zip English
Product Specifications
- Application Specification ENG_SS_114-115015_A.pdf English
- Product Specification ENG_SS_108-115122_A1.pdf English
- Qualification Test Report ENG_SS_501-115136_B.pdf English
Product Environmental Compliance
- Product Compliance ENG_PC_MD_2309412-5_A(233333).xlsx English
- Product Compliance ENG_PC_MD_2309412-5_A(785336).xml English
Additional Description for 2309412-5
Product Description
DDR4 SO DIMM Sockets are designed to JEDEC industry standards. They are available with standard and reverse key positions, GF, 5u", 10u", 15u", and 30u" gold thicknesses, 4.0mm, 5.2, 8.0, and 9.2 heights, and tray and reel packaging. DDR4 SO DIMM Socket applications include mass storage, communications, desktop PCs, and instrument equipment.
View All DDR4 SO DIMM SOCKETS (39)
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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DRAM Type : Small Outline (SO)
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Connector System : Cable-to-Board
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Sealable : No
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Connector & Contact Terminates To : Printed Circuit Board
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Center Post : Without
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Product Type : Socket
Configuration Features
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Module Orientation : Right Angle
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Number of Positions : 260
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Number of Rows : 2
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Keying : Reverse
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Number of Keys : 1
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Center Key : Offset Right
Electrical Characteristics
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DRAM Voltage (V): 1.2
Signal Characteristics
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SGRAM Voltage (V): 1.2
Body Features
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Ejector Type : Locking
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Connector Profile : High
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Module Key Type : Offset Right
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Retention Post Location : Both Ends
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Latch Material : High Temperature Thermoplastic
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Ejector Location : Both Ends
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Retention Post Material : Stainless Steel
Contact Features
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Contact Base Material : Copper Alloy
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PCB Contact Termination Area Plating Material : Gold Flash
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Contact Underplating Material : Nickel
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Contact Mating Area Plating Material : Gold
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Contact Mating Area Plating Material Thickness : .76 µm [ 30 µin ]
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Contact Current Rating (Max) (A): .5
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Socket Type : Memory Card
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Socket Style : SO DIMM
Termination Features
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Insertion Style : Cam-In
Mechanical Attachment
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PCB Mount Retention Type : Solder Peg
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PCB Mount Retention : With
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PCB Mounting Style : Surface Mount
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Connector Mounting Type : Board Mount
Housing Features
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Centerline (Pitch) : .5 mm [ .0197 in ]
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Housing Material : High Temperature Thermoplastic
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Housing Color : Black
Dimensions
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Stack Height : 8 mm [ .315 in ]
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Row-to-Row Spacing : 8.2 mm [ .322 in ]
Usage Conditions
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Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]
Operation/Application
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Circuit Application : Power
Industry Standards
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UL Flammability Rating : UL 94V-0
Packaging Features
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Packaging Method : Tape & Reel
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Packaging Quantity : 500
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