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Connectors (Sockets)
Manufacturer / Brand: TE
Desc.: LGA Sockets, LGA 257, Board-to-Board, 257 Position, Gold, Contact Mating Area Plating Material Thickness 30 µin, 1mm [.039in] Centerline
Alias (Internal Part Number): -
Quantity Available: Over 140300 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Datasheet for 2319757-1:
Detailed Description for 2319757-1:
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IC Socket Type : LGA 257
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Connector System : Board-to-Board
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Number of Positions : 257
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Contact Mating Area Plating Material : Gold
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Contact Mating Area Plating Material Thickness (µin): 30
2319757-1 Parameters
- Manufacturer Part Number : 2319757-1
- Manufacturer : TE
- Description : LGA Sockets, LGA 257, Board-to-Board, 257 Position, Gold, Contact Mating Area Plating Material Thickness 30 µin, 1mm [.039in] Centerline
- Series: -
- TE Internal Part Code: 2319757-1
- Internal Description: DUAL LGA,257 POS, DMD SOCKET
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-2319757-1
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 2319757-1
Best Price for 2319757-1
Contact us to check the best price and real time inventory quantity for 2319757-1. If you need any more information about 2319757-1, you can also send us by email. Our email is sales@buy-te.com
2319757-1 Technical Documents (Datasheet and Drawing Files)
Product Drawings
- DUAL LGA,257 POS, DMD SOCKET DUAL LGA,257 POS, DMD SOCKET English
CAD Files
- 3D PDF 3D_CVM_CVM_2319757-1_A.pdf 3D
- Customer View Model ENG_CVM_CVM_2319757-1_A.2d_dxf.zip English
- ENG_CVM_CVM_2319757-1_A.3d_igs.zip English
- ENG_CVM_CVM_2319757-1_A.3d_stp.zip English
Product Specifications
- Application Specification ENG_SS_114-115016_1.pdf English
- Product Specification ENG_SS_108-115139_A.pdf English
- Qualification Test Report ENG_SS_501-115154_A.pdf English
Product Environmental Compliance
- TE Material Declaration ENG_PC_MD_2319757-1_B.pdf English
Additional Description for 2319757-1
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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Connector System : Board-to-Board
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Sealable : No
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Connector & Contact Terminates To : Printed Circuit Board
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Product Type : Socket
Configuration Features
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Number of Positions : 257
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Grid Spacing : 1 x 1 mm [ .039 x .039 in ]
Body Features
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Plating Thickness (µin): 3
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Plating Material : Nickel Plating
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Frame Style : C Shape
Contact Features
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Contact Base Material : Copper Alloy
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IC Socket Type : LGA 257
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Contact Mating Area Plating Material : Gold
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Contact Mating Area Plating Material Thickness (µin): 30
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Contact Current Rating (Max) (A): 1
Mechanical Attachment
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PCB Mounting Style : Surface Mount
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Connector Mounting Type : Panel Mount
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Heat Sink Attachment : Without
Housing Features
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Centerline (Pitch) : 1 mm [ .039 in ]
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Housing Color : Black
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Housing Material : High Temperature Thermoplastic
Usage Conditions
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Operating Temperature Range (°C): -25 – 100
Operation/Application
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Circuit Application : Signal
Industry Standards
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UL Flammability Rating : UL 94V-0
Packaging Features
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Packaging Method : Tray
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Tray Color : White
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Email: sales@buy-te.com
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