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Connectors (Sockets)
Manufacturer / Brand: TE
Desc.: LGA Sockets, LGA 3647, Board-to-Board, 1823 Position, Gold, Contact Mating Area Plating Material Thickness 30 µin
Alias (Internal Part Number): -
Quantity Available: Over 844000 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Datasheet for 2-2129710-6:
Detailed Description for 2-2129710-6:
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IC Socket Type : LGA 3647
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Connector System : Board-to-Board
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Number of Positions : 1823
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Contact Mating Area Plating Material : Gold
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Contact Mating Area Plating Material Thickness (µin): 30
2-2129710-6 Parameters
- Manufacturer Part Number : 2-2129710-6
- Manufacturer : TE
- Description : LGA Sockets, LGA 3647, Board-to-Board, 1823 Position, Gold, Contact Mating Area Plating Material Thickness 30 µin
- Series: -
- TE Internal Part Code: 2-2129710-6
- Internal Description: RIGHT SIDE LGA3647-0 SOCKET-P0 FOR ODM
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-2-2129710-6
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 2-2129710-6
Best Price for 2-2129710-6
Contact us to check the best price and real time inventory quantity for 2-2129710-6. If you need any more information about 2-2129710-6, you can also send us by email. Our email is sales@buy-te.com
2-2129710-6 Technical Documents (Datasheet and Drawing Files)
Product Description
LGA 3647 Sockets meets the next-generation designs of Intel's new CPU processors for higher performance and better system scaling. They are available with yellow & black, natual & black, yellow, black, or natural key colors and Right & Left, Right Segment, or Left Segment final assemblies. LGA 2011 Socket applications include servers, data centers, and high performance computing (HPC).
View All LGA 3647 SOCKETS (8)
Product Drawings
- RIGHT SIDE LGA3647-0 SOCKET-P0 FOR ODM RIGHT SIDE LGA3647-0 SOCKET-P0 FOR ODM English
CAD Files
- 3D PDF 3D_CVM_CVM_2-2129710-6_C.pdf 3D
- Customer View Model ENG_CVM_CVM_2-2129710-6_C.2d_dxf.zip English
- ENG_CVM_CVM_2-2129710-6_C.3d_igs.zip English
- ENG_CVM_CVM_2-2129710-6_C.3d_stp.zip English
Datasheets & Catalog Pages
- LGA 3647 Socket Product Flyer ENG_DS_1-1773883-1_LGA3647_Socket_Flyer_0317.pdf English
Product Specifications
- Application Specification ENG_SS_114-115011_A.pdf English
Product Environmental Compliance
- MD_2-2129710-6_05162018029_dmtec ENG_PC_MD_2-2129710-6_P(162267).xlsx English
- MD_2-2129710-6_05162018029_dmtec ENG_PC_MD_2-2129710-6_P(802270).xml English
Additional Description for 2-2129710-6
Product Description
LGA 3647 Sockets meets the next-generation designs of Intel's new CPU processors for higher performance and better system scaling. They are available with yellow & black, natual & black, yellow, black, or natural key colors and Right & Left, Right Segment, or Left Segment final assemblies. LGA 2011 Socket applications include servers, data centers, and high performance computing (HPC).
View All LGA 3647 SOCKETS (8)
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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Connector System : Board-to-Board
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Connector & Contact Terminates To : Printed Circuit Board
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Product Type : Socket
Configuration Features
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Number of Positions : 1823
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Grid Spacing : .9906 x .8585 mm [ .039 x .0338 in ]
Body Features
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Plating Thickness (µin): 30
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Plating Material : Gold
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Frame Style : C Shape
Contact Features
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Contact Base Material : Copper Alloy
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IC Socket Type : LGA 3647
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Contact Mating Area Plating Material : Gold
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Contact Mating Area Plating Material Thickness (µin): 30
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Contact Current Rating (Max) (A): .5
Mechanical Attachment
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PCB Mounting Style : Surface Mount Solder Ball
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Connector Mounting Type : Board Mount
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Heat Sink Attachment : Without
Housing Features
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Centerline (Pitch) (mm): .8585, .9906
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Centerline (Pitch) (in): .0338, .039
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Housing Color : Black
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Housing Material : High Temperature Thermoplastic
Usage Conditions
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Operating Temperature Range : -25 – 100 °C [ -13 – 212 °F ]
Operation/Application
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Circuit Application : Signal
Industry Standards
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UL Flammability Rating : UL 94V-0
Packaging Features
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Packaging Method : Tray
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Tray Color : Blue
Other
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Comment : Lead-Free Solderball
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