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Connectors (Sockets)
Manufacturer / Brand: TE
Desc.: DDR3 DIMM, DIMM Sockets, Double Data Rate (DDR) 3, Board-to-Board, 240 Position, Through Hole - Solder, Vertical Module Orientation
Alias (Internal Part Number): -
Quantity Available: Over 630000 Pieces
Our Email: sales@buy-te.com (Price quote by email)

Datasheet for 4-1932000-6:

4-1932000-6 datasheet
Price for 4-1932000-6
Detailed Description for 4-1932000-6:
4-1932000-6 Parameters
  • Manufacturer Part Number : 4-1932000-6
  • Manufacturer : TE
  • Description : DDR3 DIMM, DIMM Sockets, Double Data Rate (DDR) 3, Board-to-Board, 240 Position, Through Hole - Solder, Vertical Module Orientation
  • Series: DDR3 DIMM
  • TE Internal Part Code: 4-1932000-6
  • Internal Description: VERTICAL DDR3 DIMM, 240 POSITION
  • Our Price : Contact by email
  • Function : -
  • Status : Active
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : TE-4-1932000-6
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : -
  • Other category: -
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4-1932000-6 Technical Documents (Datasheet and Drawing Files)

Product  Description

DDR3 DIMM Sockets are designed to JEDEC industry standards. They are available with vertical and right angle orientations and through hole and surface mount configurations. DDR3 DIMM Socket applications include servers, notebook PCs, and communications equipment. View All DDR3 DIMM SOCKETS (15)

Product Drawings

Datasheets & Catalog Pages

Product Specifications

Additional Description for 4-1932000-6

Product  Description

DDR3 DIMM Sockets are designed to JEDEC industry standards. They are available with vertical and right angle orientations and through hole and surface mount configurations. DDR3 DIMM Socket applications include servers, notebook PCs, and communications equipment. View All DDR3 DIMM SOCKETS (15)

Please review product documents or contact us for the latest agency approval information. 

 

Please Note: Use the Product Drawing for all design activity. 

Product Type Features

  • DRAM Type : Double Data Rate (DDR) 3

  • Connector System : Board-to-Board

  • Sealable : No

  • Connector & Contact Terminates To : Printed Circuit Board

  • Product Type : Socket

Configuration Features

  • Number of Positions : 240

  • Module Orientation : Vertical

Body Features

  • Ejector Type : Standard

Contact Features

  • Contact Current Rating (Max) (A): .75

Mechanical Attachment

  • PCB Mount Retention Type : Boardlock

  • PCB Mounting Style : Through Hole - Solder

  • Connector Mounting Type : Board Mount

  • Polarization : Left

Housing Features

  • Centerline (Pitch) : 1 mm [ .039 in ]

Dimensions

  • Row-to-Row Spacing : 1.9 mm [ .075 in ]

Usage Conditions

  • Operating Temperature Range : -55 – 155 °C [ -67 – 311 °F ]

Operation/Application

  • Circuit Application : Signal

Packaging Features

  • Packaging Method : Box & Tray, Tray

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