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PCB Connectors (Connectors Relays Components)
Manufacturer / Brand: TE
Desc.: MULTIGIG RT 2, High Speed Backplane Connectors, Board-to-Board, 135 Position, Row-to-Row Spacing 1.8 mm [.071 in], Mating Alignment
Alias (Internal Part Number): -
Quantity Available: Over 315200 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Detailed Description for 1410135-1:
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Connector System : Board-to-Board
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Number of Positions : 135
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Row-to-Row Spacing : 1.8 mm [ .071 in ]
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Mating Alignment : With
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Mating Alignment Type : Polarization
1410135-1 Parameters
- Manufacturer Part Number : 1410135-1
- Manufacturer : TE
- Description : MULTIGIG RT 2, High Speed Backplane Connectors, Board-to-Board, 135 Position, Row-to-Row Spacing 1.8 mm [.071 in], Mating Alignment
- Series: MULTIGIG RT
- TE Internal Part Code: 1410135-1
- Internal Description: MULTIGIG RT T2 .8" BP FULL CNT
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-1410135-1
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 1410135-1
Best Price for 1410135-1
Contact us to check the best price and real time inventory quantity for 1410135-1. If you need any more information about 1410135-1, you can also send us by email. Our email is sales@buy-te.com
1410135-1 Technical Documents (Datasheet and Drawing Files)
Product Drawings
- MULTIGIG RT T2 .8" BP FULL CNT MULTIGIG RT T2 .8" BP FULL CNT English
CAD Files
- Customer View Model ENG_CVM_1410135-1_A.3d_igs.zip English
- Customer View Model ENG_CVM_1410135-1_A.3d_stp.zip English
- ENG_CVM_1410135-1_A.2d_dxf.zip English
- ENG_CVM_1410135-1_A.pdf English
Datasheets & Catalog Pages
- High Speed Backplane Connectors catalog - MULTIGIG RT Connector ENG_CS_1773095_Backplane_Connector_MULTIGIG_RT_0512.pdf English
- Board-Level Interconnects for Rugged Embedded Computing Brochure ENG_DS_4-1773700-7_embedded-computing_1019.pdf English
Product Specifications
- Application Specification ENG_SS_114-13056_J.pdf English
- Application Specification ENG_SS_114-163004_B.pdf English
Product Environmental Compliance
- TE Material Declaration ENG_PC_MD_1410135-1_B.pdf English
Additional Description for 1410135-1
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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Connector System : Board-to-Board
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PCB Connector Assembly Type : PCB Mount Receptacle
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Shroud Style : Unshrouded
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Connector & Contact Terminates To : Printed Circuit Board
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Applied to Printed Circuit Board Type : Backplane
Configuration Features
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Number of Positions : 135
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Number of Rows : 9
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Number of Columns : 15
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Backplane Architecture : Traditional Backplane
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PCB Mount Orientation : Vertical
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Guide Location : Center
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Card Slot Centerline : 20.3 mm [ .8 in ]
Contact Features
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Contact Current Rating (Max) (A): 1
Mechanical Attachment
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Mating Alignment : With
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Mating Alignment Type : Polarization
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Connector Mounting Type : Board Mount
Housing Features
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Centerline (Pitch) : 1.8 mm [ .071 in ]
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Number of Shrouded Sides : 0
Dimensions
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Row-to-Row Spacing : 1.8 mm [ .071 in ]
Usage Conditions
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Operating Temperature Range : -55 – 105 °C [ -67 – 221 °F ]
Operation/Application
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Circuit Application : Power & Signal
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