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PCB Connectors (Wire-to-Board Connector Contacts)
Manufacturer / Brand: TE
Desc.: AMPMODU IV/V, Connector Contact, Socket, Wire-to-Board, 24 – 20AWG Wire Size, 394.71 – 1105.17CMA Wire Size, .2 – .56mm² Wire Size, Gold, Loose Piece
Alias (Internal Part Number): -
Quantity Available: Over 634200 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Detailed Description for 171276-5:
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Contact Type : Socket
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Connector System : Wire-to-Board
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Wire Size (AWG): 24 – 20
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Wire Size (CMA): 394.71 – 1105.17
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Wire Size (mm²): .2 – .56
171276-5 Parameters
- Manufacturer Part Number : 171276-5
- Manufacturer : TE
- Description : AMPMODU IV/V, Connector Contact, Socket, Wire-to-Board, 24 – 20AWG Wire Size, 394.71 – 1105.17CMA Wire Size, .2 – .56mm² Wire Size, Gold, Loose Piece
- Series: AMPMODU
- TE Internal Part Code: 171276-5
- Internal Description: CONTACT MOD-4 CRIMP SNAP-INLP
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-171276-5
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 171276-5
Best Price for 171276-5
Contact us to check the best price and real time inventory quantity for 171276-5. If you need any more information about 171276-5, you can also send us by email. Our email is sales@buy-te.com
171276-5 Technical Documents (Datasheet and Drawing Files)
Product Drawings
- CONTACT MOD-4 CRIMP SNAP-INLP CONTACT MOD-4 CRIMP SNAP-INLP English
- japan English
Product Specifications
- Application Specification ENG_SS_114-5026_C1.pdf English
- CRIMPING OF AMP-MODU MOD. IV, CRIMP, SNAP-IN CONTACT S_114-5026_C1.tif English
- Application Specification JPN_SS_114-5026_C1.pdf Japanese
- JPN_SS_114-5026_C1.tif Japanese
- Product Specification ENG_SS_108-5056_E.pdf English
- AMPMODU MOD IV INTERCONNECTION SYSTEM S_108-5056_E.tif English
- AMPMODU MOD IV INTERCONNECTION SYSTEM JPN_SS_108-5056_E.tif Japanese
- JPN_SS_108-5056_E.pdf Japanese
Additional Description for 171276-5
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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Connector System : Wire-to-Board
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Connector & Contact Terminates To : Wire & Cable
Configuration Features
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Compatible With Wire & Cable Type : Discrete Wire
Contact Features
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Contact Mating Area Plating Material Thickness (µin): 15
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Contact Type : Socket
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Contact Mating Area Plating Material : Gold
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Contact Current Rating (Max) (A): 3
Termination Features
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Termination Method to Wire & Cable : Crimp
Mechanical Attachment
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Wire Insulation Support : With
Dimensions
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Accepts Wire Insulation Diameter Range : 1.27 – 1.45 mm [ .05 – .057 in ]
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Wire Size (AWG): 24 – 20
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Wire Size (CMA): 394.71 – 1105.17
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Wire Size (mm²): .2 – .56
Usage Conditions
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Operating Temperature Range : -65 – 105 °C [ -85 – 221 °F ]
Operation/Application
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Circuit Application : Power & Signal
Packaging Features
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Packaging Method : Loose Piece
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