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PCB Connectors (Board-to-Board Headers & Receptacles)
Manufacturer / Brand: TE
Desc.: AMP Mezalok, PCB Mount Receptacle, Vertical, Board-to-Board, 114 Position, 1.27mm [.05in] Centerline, Gold, Printed Circuit Board
Alias (Internal Part Number): -
Quantity Available: Over 58000 Pieces
Our Email: sales@buy-te.com (Price quote by email)

Datasheet for 1-2102061-5:

1-2102061-5 datasheet
Price for 1-2102061-5
Detailed Description for 1-2102061-5:
1-2102061-5 Parameters
  • Manufacturer Part Number : 1-2102061-5
  • Manufacturer : TE
  • Description : AMP Mezalok, PCB Mount Receptacle, Vertical, Board-to-Board, 114 Position, 1.27mm [.05in] Centerline, Gold, Printed Circuit Board
  • Series: Mezalok
  • TE Internal Part Code: 1-2102061-5
  • Internal Description: Mezalok, Socket, 114 p, 15 mm, 30 Au, TL
  • Our Price : Contact by email
  • Function : -
  • Status : Active
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : TE-1-2102061-5
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : -
  • Other category: -
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Contact us to check the best price and real time inventory quantity for 1-2102061-5. If you need any more information about 1-2102061-5, you can also send us by email. Our email is sales@buy-te.com

1-2102061-5 Technical Documents (Datasheet and Drawing Files)

Product Drawings

Datasheets & Catalog Pages

Product Specifications

Additional Description for 1-2102061-5

Please review product documents or contact us for the latest agency approval information. 

 

Please Note: Use the Product Drawing for all design activity. 

Product Type Features

  • PCB Connector Assembly Type : PCB Mount Receptacle

  • Connector System : Board-to-Board

  • Sealable : No

  • Connector & Contact Terminates To : Printed Circuit Board

Configuration Features

  • Stackable : Yes

  • Number of Rows : 6

  • PCB Mount Orientation : Vertical

  • Number of Positions : 114

  • Board-to-Board Configuration : Parallel

Electrical Characteristics

  • Operating Voltage (VAC): 250

  • Dielectric Withstanding Voltage (Max) (VAC): 750

Contact Features

  • Contact Base Material : Beryllium Copper

  • PCB Contact Termination Area Plating Material : Tin-Lead

  • Contact Underplating Material : Nickel

  • Contact Mating Area Plating Material Finish : Bright

  • Contact Shape & Form : Square

  • Mating Tab Thickness : .46 mm [ .018 in ]

  • Mating Tab Width : .43 mm [ .017 in ]

  • Contact Mating Area Plating Material : Gold

  • Contact Mating Area Plating Material Thickness : .76 µm [ 29.9212 µin ]

  • Contact Type : Socket

  • Contact Current Rating (Max) (A): 1.5

  • Contact Layout : Matrix

Termination Features

  • Termination Method to Printed Circuit Board : Surface Mount - Solder Ball

Mechanical Attachment

  • PCB Mount Retention Type : Solder Ball

  • Mating Alignment : With

  • Mating Alignment Type : Polarizing Tab

  • PCB Mount Retention : Without

  • PCB Mount Alignment : Without

  • Connector Mounting Type : Board Mount

  • PCB Mount Alignment Type : None

Housing Features

  • Mating Entry Location : Top

  • Centerline (Pitch) : 1.27 mm [ .05 in ]

  • Housing Color : Natural

  • Housing Material : LCP (Liquid Crystal Polymer)

Dimensions

  • Connector Height : 11 mm [ .4323 in ]

  • Row-to-Row Spacing : 1.27 mm [ .05 in ]

  • Stack Height : 15 mm [ .591 in ]

  • PCB Thickness (Recommended) : 2.36 mm [ .093 in ]

Usage Conditions

  • Operating Temperature Range : -55 – 125 °C [ -67 – 257 °F ]

Operation/Application

  • Assembly Process Feature : Pick and Place Cover

  • Circuit Application : Signal

Industry Standards

  • Industry Standard : VITA 61

Packaging Features

  • Packaging Quantity : 230

  • Packaging Method : Tape & Reel

Other

  • Comment : Conforms to requirement of VITA 61 (VITA 42 Alternate)., VITA 42 and VITA 61 are not intermateable but are footprint and XMC architecture compatible.

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