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PCB Connectors (Connectors Relays Components)
Manufacturer / Brand: TE
Desc.: MULTIGIG RT 3, High Speed Backplane Connectors, Board-to-Board, 112 Position, Row-to-Row Spacing 1.35 mm [.053 in], Mating Alignment
Alias (Internal Part Number): -
Quantity Available: Over 333300 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Datasheet for 2302794-2:
Detailed Description for 2302794-2:
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Connector System : Board-to-Board
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Number of Positions : 112
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Row-to-Row Spacing : 1.35 mm [ .053 in ]
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Mating Alignment : With
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Mating Alignment Type : Keyed
2302794-2 Parameters
- Manufacturer Part Number : 2302794-2
- Manufacturer : TE
- Description : MULTIGIG RT 3, High Speed Backplane Connectors, Board-to-Board, 112 Position, Row-to-Row Spacing 1.35 mm [.053 in], Mating Alignment
- Series: MULTIGIG RT 3
- TE Internal Part Code: 2302794-2
- Internal Description: RAPLUGASSY,CENTERRP0,RTM,VPX,MGRT3
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-2302794-2
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 2302794-2
Best Price for 2302794-2
Contact us to check the best price and real time inventory quantity for 2302794-2. If you need any more information about 2302794-2, you can also send us by email. Our email is sales@buy-te.com
2302794-2 Technical Documents (Datasheet and Drawing Files)
Product Drawings
- RAPLUGASSY,CENTERRP0,RTM,VPX,MGRT3 RAPLUGASSY,CENTERRP0,RTM,VPX,MGRT3 English
CAD Files
- 3D PDF 3D_CVM_CVM_2302794-2_2.pdf 3D
- Customer View Model ENG_CVM_CVM_2302794-2_2.2d_dxf.zip English
- ENG_CVM_CVM_2302794-2_2.3d_igs.zip English
- ENG_CVM_CVM_2302794-2_2.3d_stp.zip English
Datasheets & Catalog Pages
- Board-Level Interconnects for Rugged Embedded Computing Brochure ENG_DS_4-1773700-7_embedded-computing_1019.pdf English
Product Specifications
- Application Specification ENG_SS_114-163004_B.pdf English
- Product Specification ENG_SS_108-2072-3_A2.pdf English
Additional Description for 2302794-2
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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Connector System : Board-to-Board
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PCB Connector Assembly Type : PCB Mount Header
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Shroud Style : Unshrouded
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Sealable : No
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Connector & Contact Terminates To : Printed Circuit Board
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Applied to Printed Circuit Board Type : Daughtercard
Configuration Features
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Number of Signal Positions : 20
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Number of Pairs : 20
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Number of Power Positions : 4
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Number of Positions : 112
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Number of Rows : 7
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Number of Columns : 16
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Backplane Architecture : Traditional Backplane
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PCB Mount Orientation : Right Angle
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Guide Location : Unguided
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Card Slot Centerline : 20.3 mm [ .8 in ]
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Number of Ground Positions : 31
Signal Characteristics
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Number of Differential Pairs per Column : 2
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Differential Impedance (Ω): 100
Contact Features
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Contact Current Rating (Max) (A): 1
Termination Features
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Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Mechanical Attachment
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Mating Alignment : With
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Mating Alignment Type : Keyed
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Connector Mounting Type : Board Mount
Housing Features
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Housing Material : LCP - GF (Liquid Crystal Polymer)
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Centerline (Pitch) : 1.8 mm [ .075 in ]
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Number of Shrouded Sides : 2
Dimensions
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Row-to-Row Spacing : 1.35 mm [ .053 in ]
Usage Conditions
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Operating Temperature Range : -55 – 125 °C [ -67 – 221 °F ]
Operation/Application
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Circuit Application : Power & Signal
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