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PCB Connectors (Board-to-Board Headers & Receptacles)
Manufacturer / Brand: TE
Desc.: AMPMODU Small Centerline, PCB Mount Header, Vertical, Board-to-Board, 4 Position, 1mm [.04in] Centerline, Breakaway, Gold Flash, Printed Circuit Board
Alias (Internal Part Number): -
Quantity Available: Over 703900 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Datasheet for 2331928-2:
Detailed Description for 2331928-2:
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PCB Connector Assembly Type : PCB Mount Header
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PCB Mount Orientation : Vertical
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Connector System : Board-to-Board
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Number of Positions : 4
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Centerline (Pitch) : 1 mm [ .04 in ]
2331928-2 Parameters
- Manufacturer Part Number : 2331928-2
- Manufacturer : TE
- Description : AMPMODU Small Centerline, PCB Mount Header, Vertical, Board-to-Board, 4 Position, 1mm [.04in] Centerline, Breakaway, Gold Flash, Printed Circuit Board
- Series: AMPMODU
- TE Internal Part Code: 2331928-2
- Internal Description: SCL 1.0 HDR DRVT USP 004 SMT G1 TB
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-2331928-2
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 2331928-2
Best Price for 2331928-2
Contact us to check the best price and real time inventory quantity for 2331928-2. If you need any more information about 2331928-2, you can also send us by email. Our email is sales@buy-te.com
2331928-2 Technical Documents (Datasheet and Drawing Files)
Product Drawings
- SCL 1.0 HDR DRVT USP 004 SMT G1 TB SCL 1.0 HDR DRVT USP 004 SMT G1 TB English
CAD Files
- 3D PDF 3D_CVM_CVM_2331928-2_4.pdf 3D
- Customer View Model ENG_CVM_CVM_2331928-2_4.2d_dxf.zip English
- ENG_CVM_CVM_2331928-2_4.3d_igs.zip English
- ENG_CVM_CVM_2331928-2_4.3d_stp.zip English
Datasheets & Catalog Pages
- AMPMODU 1.0 mm CENTERLINE INTERCONNECTION SYSTEMS ENG_DS_3-1773984-4_2010.pdf English
Product Specifications
- Application Specification ENG_SS_114-32210_1.pdf English
- Product Specification ENG_SS_108-32154_5.pdf English
Agency Approvals
- UL Report ENG_AAD_UL_E28476_20200131_A.pdf English
Additional Description for 2331928-2
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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PCB Connector Assembly Type : PCB Mount Header
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Connector System : Board-to-Board
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Header Type : Breakaway
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Connector & Contact Terminates To : Printed Circuit Board
Configuration Features
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Number of Signal Positions : 4
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Number of Loaded Positions : 4
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Number of Columns : 2
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Number of Rows : 2
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PCB Mount Orientation : Vertical
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Number of Positions : 4
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Pairs per Column : 1
Body Features
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Connector Profile : Standard
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Assembly Process Feature Material : Thermoplastic
Contact Features
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Contact Base Material : Phosphor Bronze
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PCB Contact Termination Area Plating Material : Tin
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Contact Underplating Material : Nickel
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Contact Shape & Form : Square
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PCB Contact Termination Area Plating Material Finish : Matte
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Contact Underplating Material Thickness : 1.27 µm [ 50 µin ]
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PCB Contact Termination Area Plating Material Thickness : 3 – 5 µm [ 100 – 200 µin ]
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Mating Square Post Dimension : .3 mm [ .012 in ]
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Contact Mating Area Plating Material : Gold Flash
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Contact Mating Area Plating Material Thickness : .1 µm [ 4 µin ]
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Contact Type : Pin
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Contact Current Rating (Max) (A): 1
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Contact Mating Area Length : 1.9 mm [ .074 in ]
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Contact Layout : In-line
Termination Features
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Termination Method to Printed Circuit Board : Surface Mount
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Square Termination Post & Tail Dimension : .3 mm [ .012 in ]
Mechanical Attachment
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Mating Alignment : Without
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PCB Mount Retention : Without
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Connector Mounting Type : Board Mount
Housing Features
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Mating Entry Location : Top
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Centerline (Pitch) : 1 mm [ .04 in ]
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Housing Color : Black
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Housing Material : LCP
Dimensions
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Connector Height : 1.5 mm [ .06 in ]
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Row-to-Row Spacing : 1 mm [ .04 in ]
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Stack Height : 4.3 mm [ .169 in ]
Usage Conditions
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Operating Temperature Range : -55 – 125 °C [ -67 – 257 °F ]
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Housing Temperature Rating : High
Operation/Application
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Assembly Process Feature : Pick and Place Cover
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Solder Process Feature : Board Standoff
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Circuit Application : Signal
Industry Standards
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UL Flammability Rating : UL 94V-0
Packaging Features
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Packaging Method : Tube
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