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PCB Connectors (Board-to-Board Connector Contacts)
Manufacturer / Brand: TE
Desc.: AMPMODU MOD 1, Connector Contact, Socket, Board-to-Board, 3.81mm [.149733in] Centerline, Tin, 22 – 18AWG Wire Size, .3 – .9mm² Wire Size, Straight
Alias (Internal Part Number): 197384-000
Quantity Available: Over 807300 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Datasheet for 280702-1:
Detailed Description for 280702-1:
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Contact Type : Socket
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Connector System : Board-to-Board
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Centerline (Pitch) : 3.81 mm [ .149733 in ]
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Contact Mating Area Plating Material : Tin
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Wire Size (AWG): 22 – 18
280702-1 Parameters
- Manufacturer Part Number : 280702-1
- Manufacturer : TE
- Description : AMPMODU MOD 1, Connector Contact, Socket, Board-to-Board, 3.81mm [.149733in] Centerline, Tin, 22 – 18AWG Wire Size, .3 – .9mm² Wire Size, Straight
- Series: AMPMODU
- TE Internal Part Code: 280702-1
- Internal Description: AMPMODU CONT.
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-280702-1
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 280702-1
Best Price for 280702-1
Contact us to check the best price and real time inventory quantity for 280702-1. If you need any more information about 280702-1, you can also send us by email. Our email is sales@buy-te.com
280702-1 Technical Documents (Datasheet and Drawing Files)
Product Drawings
- AMPMODU CONT. AMPMODU CONT. English
- AMP MODU 1 REC. CONTACT, HIGH PRESSURE, C.O.S.I. English
CAD Files
- 3D PDF ENG_CVM_280702-1_G.pdf English
- Customer View Model ENG_CVM_280702-1_G.3d_igs.zip English
- ENG_CVM_280702-1_G.3d_stp.zip English
- ENG_CVM_280702-1_G.2d_dxf.zip English
Product Specifications
- Application Specification ENG_SS_114-20040_A3.pdf English
- Product Specification ENG_SS_108-20026_E_108-20026.pdf English
Product Environmental Compliance
- MD_280702-1 ENG_PC_MD_280702-1_C(701321).xml English
- MD_280702-1 ENG_PC_MD_280702-1_C(427369).xlsx English
Additional Description for 280702-1
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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Applied Pressure : High
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Connector System : Board-to-Board
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Connector & Contact Terminates To : Wire & Cable
Contact Features
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Contact Base Material : Phosphor Bronze
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PCB Contact Termination Area Plating Material : Tin
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Contact Mating Area Plating Material Thickness : .8 µm [ 31.496 µin ]
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PCB Contact Termination Area Plating Material Thickness : .8 µm [ 31.496 µin ]
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Contact Type : Socket
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Contact Mating Area Plating Material : Tin
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Contact Orientation : Straight
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Contact Current Rating (Max) (A): 5
Mechanical Attachment
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PCB Mount Retention : Without
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Wire Insulation Support : With
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Connector Mounting Type : Board Mount
Housing Features
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Centerline (Pitch) : 3.81 mm [ .149733 in ]
Dimensions
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Accepts Wire Insulation Diameter Range : 1.8 – 2.3 mm [ .071 – .091 in ]
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Wire Size (AWG): 22 – 18
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Wire Size (mm²): .3 – .9
Usage Conditions
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Operating Temperature Range : -40 – 105 °C [ -40 – 221 °F ]
Operation/Application
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Circuit Application : Signal
Packaging Features
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Packaging Method : Reel
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Packaging Quantity : 5000
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