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PCB Connectors (Board-to-Board Connector Contacts)
Manufacturer / Brand: TE
Desc.: AMPMODU MOD 1, Connector Contact, Socket, Board-to-Board, 3.81mm [.149733in] Centerline, Tin, 20 – 17AWG Wire Size, .5 – 1mm² Wire Size, Straight
Alias (Internal Part Number): -
Quantity Available: Over 480300 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Datasheet for 281423-1:
Detailed Description for 281423-1:
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Contact Type : Socket
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Connector System : Board-to-Board
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Centerline (Pitch) : 3.81 mm [ .149733 in ]
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Contact Mating Area Plating Material : Tin
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Wire Size (AWG): 20 – 17
281423-1 Parameters
- Manufacturer Part Number : 281423-1
- Manufacturer : TE
- Description : AMPMODU MOD 1, Connector Contact, Socket, Board-to-Board, 3.81mm [.149733in] Centerline, Tin, 20 – 17AWG Wire Size, .5 – 1mm² Wire Size, Straight
- Series: AMPMODU
- TE Internal Part Code: 281423-1
- Internal Description: MODU I REC.
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-281423-1
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 281423-1
Best Price for 281423-1
Contact us to check the best price and real time inventory quantity for 281423-1. If you need any more information about 281423-1, you can also send us by email. Our email is sales@buy-te.com
281423-1 Technical Documents (Datasheet and Drawing Files)
Product Drawings
- AMP I REC CONTACT HIGH PRESSURE, C.O.S.I. English
- MODU I REC. MODU I REC. English
CAD Files
- 3D PDF ENG_CVM_281423-1_H.pdf English
- Customer View Model ENG_CVM_281423-1_H.3d_igs.zip English
- ENG_CVM_281423-1_H.3d_stp.zip English
- ENG_CVM_281423-1_H.2d_dxf.zip English
Product Specifications
- Application Specification ENG_SS_114-20040_A3.pdf English
- Product Specification ENG_SS_108-20026_E_108-20026.pdf English
Additional Description for 281423-1
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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Applied Pressure : High
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Connector System : Board-to-Board
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Connector & Contact Terminates To : Wire & Cable
Contact Features
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Contact Base Material : Phosphor Bronze
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PCB Contact Termination Area Plating Material : Tin
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Contact Mating Area Plating Material Thickness : .8 µm [ 31.496 µin ]
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PCB Contact Termination Area Plating Material Thickness : .8 µm [ 31.496 µin ]
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Contact Type : Socket
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Contact Mating Area Plating Material : Tin
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Contact Orientation : Straight
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Contact Current Rating (Max) (A): 5
Mechanical Attachment
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PCB Mount Retention : Without
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Wire Insulation Support : With
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Connector Mounting Type : Board Mount
Housing Features
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Centerline (Pitch) : 3.81 mm [ .149733 in ]
Dimensions
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Accepts Wire Insulation Diameter Range : 2.2 – 2.8 mm [ .086 – .11 in ]
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Wire Size (AWG): 20 – 17
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Wire Size (mm²): .5 – 1
Usage Conditions
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Operating Temperature Range : -40 – 105 °C [ -40 – 221 °F ]
Operation/Application
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Circuit Application : Signal
Packaging Features
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Packaging Method : Reel
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Packaging Quantity : 5000
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