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PCB Connectors (Wire-to-Board Connector Contacts)
Manufacturer / Brand: TE
Desc.: Connector Contact, Socket, Wire-to-Board, 2.5mm [.098in] Centerline, 28 – 22AWG Wire Size, .079 – .38mm² Wire Size, Pre-Tin, Reel, Wire & Cable
Alias (Internal Part Number): -
Quantity Available: Over 657200 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Detailed Description for 440134-1:
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Contact Type : Socket
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Connector System : Wire-to-Board
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Centerline (Pitch) : 2.5 mm [ .098 in ]
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Wire Size (AWG): 28 – 22
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Wire Size (mm²): .079 – .38
440134-1 Parameters
- Manufacturer Part Number : 440134-1
- Manufacturer : TE
- Description : Connector Contact, Socket, Wire-to-Board, 2.5mm [.098in] Centerline, 28 – 22AWG Wire Size, .079 – .38mm² Wire Size, Pre-Tin, Reel, Wire & Cable
- Series: -
- TE Internal Part Code: 440134-1
- Internal Description: 2.5mm,Crimp Contact
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-440134-1
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 440134-1
Best Price for 440134-1
Contact us to check the best price and real time inventory quantity for 440134-1. If you need any more information about 440134-1, you can also send us by email. Our email is sales@buy-te.com
440134-1 Technical Documents (Datasheet and Drawing Files)
Product Drawings
- 2.5mm Pitch HPI Crimp Contact English
- 2.5mm,Crimp Contact 2.5mm,Crimp Contact English
CAD Files
- 3D PDF 3D_CVM_CVM_440134-1_B_c-440134-1-b-3d.pdf 3D
- Customer View Model ENG_CVM_CVM_440134-1_B_c-440134-1-b.2d_dxf.zip English
- ENG_CVM_CVM_440134-1_B_c-440134-1-b.3d_igs.zip English
- ENG_CVM_CVM_440134-1_B_c-440134-1-b.3d_stp.zip English
Datasheets & Catalog Pages
- HPI Connectors QRG ENG_DS_1-1773713-2_HPI_QRG_EN_0820.pdf English
Product Specifications
- AMP 2.5mm Pitch HPI (Low Cost) W-to-B System Test Report S_502-57001-1_O1.tif English
- Engineering Report S_502-57001-1_O1.pdf English
- AMP 2.5MM PITCH HPI WIRE TO BOARD SYSTEM. S_114-57004_A.tif English
- Application Specification S_114-57004_A.pdf English
- Product Specification ENG_SS_108-57099-1_A1.pdf English
- AMP 2.5mm Pitch HPI High Performance Interconnect (Low Cost) Wire-to-Board System S_108-57099-1_A1.tif English
- ENG_SS_108-1235-1_A.pdf English
- S_108-57099_D.pdf English
- S_108-57099_D.tif English
- Qualification Test Report ENG_SS_501-57057-1_O1.pdf English
- AMP 2.5mm Pitch HPI High Performance Interconnect (Low Cost) Wire-to-Board System S_501-57057-1_O1.tif English
Product Environmental Compliance
- TE Material Declaration ENG_PC_MD_440134-1_F.pdf English
Additional Description for 440134-1
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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Connector System : Wire-to-Board
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Sealable : No
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Connector & Contact Terminates To : Wire & Cable
Configuration Features
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Compatible With Wire & Cable Type : Discrete Wire
Electrical Characteristics
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Operating Voltage (VAC): 250
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Operating Voltage (VDC): 250
Contact Features
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Contact Base Material : Phosphor Bronze
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Wire Contact Termination Area Plating Material : Pre-Tin
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Wire Contact Termination Area Plating Material Thickness (µin): 80
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Contact Type : Socket
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Contact Mating Area Plating Material : Pre-Tin
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Contact Current Rating (Max) (A): 3
Termination Features
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Termination Method to Wire & Cable : Crimp
Mechanical Attachment
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Connector Mounting Type : Cable Mount (Free-Hanging)
Housing Features
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Centerline (Pitch) : 2.5 mm [ .098 in ]
Dimensions
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Wire Size (AWG): 28 – 22
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Wire Size (mm²): .079 – .38
Usage Conditions
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Operating Temperature Range : -25 – 105 °C [ -13 – 221 °F ]
Operation/Application
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Circuit Application : Signal
Packaging Features
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Packaging Quantity : 10000
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Packaging Method : Reel
Other
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Comment : 114-57004
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