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PCB Connectors (Board-to-Board Headers & Receptacles)
Manufacturer / Brand: TE
Desc.: PCB Mount Receptacle, Right Angle, Board-to-Board, 88 Position, 2.54mm [.1in] Centerline, Header & Push-Push Assembly, Gold, Printed Circuit Board
Alias (Internal Part Number): -
Quantity Available: Over 87500 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Datasheet for 533012-3:
Detailed Description for 533012-3:
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PCB Connector Assembly Type : PCB Mount Receptacle
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PCB Mount Orientation : Right Angle
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Connector System : Board-to-Board
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Number of Positions : 88
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Centerline (Pitch) : 2.54 mm [ .1 in ]
533012-3 Parameters
- Manufacturer Part Number : 533012-3
- Manufacturer : TE
- Description : PCB Mount Receptacle, Right Angle, Board-to-Board, 88 Position, 2.54mm [.1in] Centerline, Header & Push-Push Assembly, Gold, Printed Circuit Board
- Series: AMPMODU
- TE Internal Part Code: 533012-3
- Internal Description: 88 MODII HORZ DR OE 100CL/175
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-533012-3
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 533012-3
Best Price for 533012-3
Contact us to check the best price and real time inventory quantity for 533012-3. If you need any more information about 533012-3, you can also send us by email. Our email is sales@buy-te.com
533012-3 Technical Documents (Datasheet and Drawing Files)
Product Drawings
- HOUSING ASSEMBLY, MOD II, DBL ROW IN LINE, .100 x .100@22, SHORT POINT OF CONTACT English
- 88 MODII HORZ DR OE 100CL/175 88 MODII HORZ DR OE 100CL/175 English
CAD Files
- 3D PDF 3D_CVM_CVM_533012-3_D.pdf 3D
- Customer View Model ENG_CVM_CVM_533012-3_D.2d_dxf.zip English
- ENG_CVM_CVM_533012-3_D.3d_igs.zip English
- ENG_CVM_CVM_533012-3_D.3d_stp.zip English
Datasheets & Catalog Pages
- Products for Aerospace and Defense ENG_DS_1308940_Aerospace_Defense_0118.pdf English
Additional Description for 533012-3
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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PCB Connector Assembly Type : PCB Mount Receptacle
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Connector System : Board-to-Board
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Header Type : Header & Push-Push Assembly
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Sealable : No
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Connector & Contact Terminates To : Printed Circuit Board
Configuration Features
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Stackable : No
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Number of Rows : 2
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PCB Mount Orientation : Right Angle
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Number of Positions : 88
Body Features
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Connector Profile : Standard
Contact Features
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Contact Base Material : Beryllium Copper
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PCB Contact Termination Area Plating Material : Gold Flash
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Contact Shape & Form : Short Point
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PCB Contact Termination Area Plating Material Thickness : .762 µm [ 30 µin ]
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Mating Square Post Dimension : .68 mm [ .027 in ]
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Contact Mating Area Plating Material : Gold
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Contact Mating Area Plating Material Thickness : .76 µm [ 30 µin ]
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Contact Type : Socket
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Contact Current Rating (Max) (A): 3
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Contact Protection Type : Closed Entry Housing
Termination Features
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Termination Post & Tail Length : 4.45 mm [ .175 in ]
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Termination Method to Printed Circuit Board : Through Hole - Solder
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Rectangular Termination Post & Tail Width : .76 mm [ .03 in ]
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Rectangular Termination Post & Tail Thickness : .2 mm [ .008 in ]
Mechanical Attachment
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Mating Alignment : With
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Mating Alignment Type : Guide Pins
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PCB Mount Retention : Without
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PCB Mount Alignment : With
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Connector Mounting Type : Fixing Screw
Housing Features
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Mating Entry Location : Side
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Centerline (Pitch) : 2.54 mm [ .1 in ]
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Housing Color : Natural
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Housing Material : Polyphenylene Sulfide (PPS)
Dimensions
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Connector Height : 6.05 mm [ .238 in ]
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Row-to-Row Spacing (mm): 2.54, 7.87
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Row-to-Row Spacing (in): .31
Usage Conditions
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Operating Temperature Range : -65 – 125 °C [ -85 – 257 °F ]
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Housing Temperature Rating : Standard
Operation/Application
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Solder Process Feature : Board Standoff
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Circuit Application : Signal
Packaging Features
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Packaging Quantity : 20
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Packaging Method : Tube
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