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PCB Connectors (Board-to-Board Headers & Receptacles)
Manufacturer / Brand: TE
Desc.: Micro Stack, PCB Mount Header, Vertical, Board-to-Board, 80 Position, .6mm [.023in] Centerline, Gold, Printed Circuit Board
Alias (Internal Part Number): -
Quantity Available: Over 773100 Pieces
Our Email: sales@buy-te.com (Price quote by email)

Datasheet for 6376611-2:

6376611-2 datasheet
Price for 6376611-2
Detailed Description for 6376611-2:
6376611-2 Parameters
  • Manufacturer Part Number : 6376611-2
  • Manufacturer : TE
  • Description : Micro Stack, PCB Mount Header, Vertical, Board-to-Board, 80 Position, .6mm [.023in] Centerline, Gold, Printed Circuit Board
  • Series: AMPMODU
  • TE Internal Part Code: 6376611-2
  • Internal Description: MICRO STACK HDR ASSY 80P H6.75
  • Our Price : Contact by email
  • Function : -
  • Status : Active
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : TE-6376611-2
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : -
  • Other category: -
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6376611-2 Technical Documents (Datasheet and Drawing Files)

Product Drawings

Product Specifications

Additional Description for 6376611-2

Please review product documents or contact us for the latest agency approval information. 

 

Please Note: Use the Product Drawing for all design activity. 

Product Type Features

  • PCB Connector Assembly Type : PCB Mount Header

  • Connector System : Board-to-Board

  • Sealable : No

  • Connector & Contact Terminates To : Printed Circuit Board

Configuration Features

  • Stackable : Yes

  • Number of Rows : 2

  • PCB Mount Orientation : Vertical

  • Number of Positions : 80

  • Board-to-Board Configuration : Parallel

Electrical Characteristics

  • Operating Voltage (VAC): 10

Contact Features

  • Contact Base Material : Copper Alloy

  • PCB Contact Termination Area Plating Material : Gold Flash

  • Contact Mating Area Plating Material : Gold

  • Contact Mating Area Plating Material Thickness (µm): .3

  • Contact Type : Pin

  • Contact Current Rating (Max) (A): .5

Termination Features

  • Termination Method to Printed Circuit Board : Surface Mount

  • Rectangular Termination Post & Tail Width : 1 mm [ .04 in ]

  • Rectangular Termination Post & Tail Thickness : .2 mm [ .008 in ]

Mechanical Attachment

  • PCB Mount Retention Type : Solder Peg

  • Mating Alignment : With

  • Mating Alignment Type : Chamfered Edges

  • PCB Mount Retention : With

  • PCB Mount Alignment : With

  • Connector Mounting Type : Board Mount

  • PCB Mount Alignment Type : Solder Peg

Housing Features

  • Mating Entry Location : Top

  • Centerline (Pitch) : .6 mm [ .023 in ]

  • Housing Color : Black

  • Housing Material : LCP (Liquid Crystal Polymer)

Dimensions

  • Connector Height : 6.76 mm [ .265 in ]

  • Row-to-Row Spacing : 2.8 mm [ .11 in ]

  • PCB Thickness (Recommended) (mm): 1.6

Usage Conditions

  • Operating Temperature Range : -55 – 85 °C [ -67 – 185 °F ]

Operation/Application

  • Assembly Process Feature : Pick and Place Cover

  • Circuit Application : Signal

Industry Standards

  • UL Flammability Rating : UL 94V-0

Packaging Features

  • Packaging Quantity : 45

  • Packaging Method : Semi-Hard Tray

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