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PCB Connectors (Board-to-Board Headers & Receptacles)
Manufacturer / Brand: TE
Desc.: Modu Connector System, PCB Mount Receptacle, Right Angle / Horizontal, Board-to-Board, 8 Position, 2.54mm [.1in] Centerline, Gold
Alias (Internal Part Number): -
Quantity Available: Over 361800 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Detailed Description for 6-5535512-3:
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PCB Connector Assembly Type : PCB Mount Receptacle
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PCB Mount Orientation : Horizontal, Right Angle
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Connector System : Board-to-Board
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Number of Positions : 8
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Centerline (Pitch) : 2.54 mm [ .1 in ]
6-5535512-3 Parameters
- Manufacturer Part Number : 6-5535512-3
- Manufacturer : TE
- Description : Modu Connector System, PCB Mount Receptacle, Right Angle / Horizontal, Board-to-Board, 8 Position, 2.54mm [.1in] Centerline, Gold
- Series: AMPMODU
- TE Internal Part Code: 6-5535512-3
- Internal Description: 08 MODII HORZ DR CE EESS .100
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-6-5535512-3
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 6-5535512-3
Best Price for 6-5535512-3
Contact us to check the best price and real time inventory quantity for 6-5535512-3. If you need any more information about 6-5535512-3, you can also send us by email. Our email is sales@buy-te.com
6-5535512-3 Technical Documents (Datasheet and Drawing Files)
Product Drawings
- 08 MODII HORZ DR CE EESS .100 08 MODII HORZ DR CE EESS .100 English
CAD Files
- PCB Design Download symbol & footprint (SnapEDA)
- Download symbol & footprint (Ultra Librarian)
- 3D PDF 3D_CVM_CVM_6-5535512-3_A.pdf 3D
- Customer View Model ENG_CVM_CVM_6-5535512-3_A.2d_dxf.zip English
- ENG_CVM_CVM_6-5535512-3_A.3d_igs.zip English
- ENG_CVM_CVM_6-5535512-3_A.3d_stp.zip English
Datasheets & Catalog Pages
- AMPMODU_INTERCONNECTION_SYSTEM_SECTION5 ENG_CS_1307819_SECTION_5_0908.pdf English
Product Specifications
- Application Specification ENG_SS_114-25018_E.pdf English
- Product Specification ENG_SS_108-25026_D.pdf English
Additional Description for 6-5535512-3
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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Applied Pressure : High, Standard
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PCB Connector Assembly Type : PCB Mount Receptacle
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Connector System : Board-to-Board
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Sealable : No
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Connector & Contact Terminates To : Printed Circuit Board
Configuration Features
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Stackable : Yes
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Number of Rows : 2
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PCB Mount Orientation : Horizontal, Right Angle
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Number of Positions : 8
Electrical Characteristics
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Operating Voltage (VAC): 333
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Insulation Resistance (MΩ): 5000
Body Features
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Connector Profile : Standard
Contact Features
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Contact Base Material : Phosphor Bronze
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PCB Contact Termination Area Plating Material : Tin
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Contact Shape & Form : Short Point
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PCB Contact Termination Area Plating Material Thickness (µm): 3.81 – 7.62
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Mating Square Post Dimension : .64 mm [ .025 in ]
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Contact Mating Area Plating Material : Gold
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Contact Mating Area Plating Material Thickness : .762 µm [ 30 µin ]
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Contact Type : Socket
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Contact Current Rating (Max) (A): 2
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Contact Protection Type : Closed Entry Housing
Termination Features
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Termination Post & Tail Length : 2.92 mm [ .115 in ]
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Termination Method to Printed Circuit Board : Through Hole - Solder
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Rectangular Termination Post & Tail Width : .69 mm [ .027 in ]
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Rectangular Termination Post & Tail Thickness : .2 mm [ .008 in ]
Mechanical Attachment
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Mating Alignment : Without
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PCB Mount Retention : Without
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PCB Mount Alignment : Without
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Connector Mounting Type : Board Mount
Housing Features
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Mating Entry Location : Side
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Centerline (Pitch) : 2.54 mm [ .1 in ]
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Housing Color : Black
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Housing Material : Polyester - GF
Dimensions
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Connector Height : 6.05 mm [ .238 in ]
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Row-to-Row Spacing (mm): 2.54, 7.87
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Row-to-Row Spacing (in): .31
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Stack Height : 8.13 mm [ .32 in ]
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PCB Thickness (Recommended) : 1.4 – 2.4 mm [ .055 – .094 in ]
Usage Conditions
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Operating Temperature Range : -65 – 125 °C [ -85 – 221 °F ]
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Housing Temperature Rating : High
Operation/Application
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Solder Process Feature : Board Standoff
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Circuit Application : Signal
Industry Standards
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Approved Standards : CSA LR7189, UL E28476
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UL Flammability Rating : UL 94V-0
Packaging Features
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Packaging Quantity : 56
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Packaging Method : Box & Tube, Tube
Other
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Comment : 6.50 [.256] minimum positive pin stop to prevent shorting between rows., TE recommends mating gold or duplex plated headers with duplex plated receptacle assemblies.
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